1. Soldadura buena, humectante, brillante y completa; baja emisión de humo; sin olor irritante. 2. Baja resistencia residual y alto aislamiento, alta actividad, fuerte fuerza de soldadura. 3. Fácil de soldar; protege las pistas BGA de la corrosión y la humedad. 4. Buena humectación, resistencia a la sequedad, larga vida útil a temperatura ambiente. 5. Se utiliza para la soldadura SMT de placas de circuitos impresos.
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